Invention Grant
- Patent Title: Headphones
- Patent Title (中): 耳机
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Application No.: US12217469Application Date: 2008-07-03
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Publication No.: US08861766B2Publication Date: 2014-10-14
- Inventor: Makoto Ouryouji
- Applicant: Makoto Ouryouji
- Applicant Address: JP Kanagawa-Ku, Yokohama-Shi, Kanagawa-Ken
- Assignee: Victor Company of Japan, Ltd.
- Current Assignee: Victor Company of Japan, Ltd.
- Current Assignee Address: JP Kanagawa-Ku, Yokohama-Shi, Kanagawa-Ken
- Agency: Renner, Kenner, Greive, Bobak, Taylor & Weber
- Priority: JP2007-176009 20070704
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10 ; H04R5/033

Abstract:
A headphone set has at least one speaker section. The speaker section includes a baffle having at least one sound emitting hole, a surrounding wall formed on the baffle so that the surrounding wall protrudes from the baffle and surrounds the sound emitting hole, a speaker unit installed within the surrounding wall and having a first surface to face the sound emitting hole and an opposite second surface, a unit case provided as touching the surrounding wall and covering the second surface of the speaker unit, a first cavity existing as enclosed by the unit case and the second surface of the speaker unit, and a housing provided as touching the baffle and covering the unit case, a second cavity existing as enclosed by the housing, the unit case, and the baffle.
Public/Granted literature
- US20090010474A1 Headphones Public/Granted day:2009-01-08
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