Invention Grant
- Patent Title: Method for connecting a plurality of elements of a circuit board
- Patent Title (中): 用于连接电路板的多个元件的方法
-
Application No.: US13393697Application Date: 2010-09-01
-
Publication No.: US08863375B2Publication Date: 2014-10-21
- Inventor: Christoph Thumser , Gerhard Freydl
- Applicant: Christoph Thumser , Gerhard Freydl
- Applicant Address: AT Leoben-Hinterberg
- Assignee: AT & S Austria Technologie & Sytemtechnik Aktiengesellschaft
- Current Assignee: AT & S Austria Technologie & Sytemtechnik Aktiengesellschaft
- Current Assignee Address: AT Leoben-Hinterberg
- Agency: Jacobson Holman, PLLC.
- Priority: ATGM552/2009 20090903
- International Application: PCT/AT2010/000316 WO 20100901
- International Announcement: WO2011/026165 WO 20110310
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K3/00 ; H05K1/14 ; H05K1/02

Abstract:
The invention relates to a method for connecting a plurality of elements for a circuit board, comprising the following steps: providing the elements of a circuit board to be connected to each other, the elements having contours adapted to each other; arranging the elements to be connected to each other in close proximity in at least one of two peripheral areas that have complementary contours, while maintaining a distance between opposing peripheral areas; and mechanically connecting the opposing peripheral areas by means of at least one sub-area thereof in order to connect the elements of the circuit board to be connected to each other. Furthermore, a circuit board produced from a plurality of elements connected to each other is provided.
Public/Granted literature
Information query