Invention Grant
- Patent Title: Pair of substrate holders, substrate holder, substrate bonding apparatus and method for manufacturing device
- Patent Title (中): 一对基板支架，基板支架，基板接合装置及其制造方法
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Application No.: US13524820Application Date: 2012-06-15
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Publication No.: US08863808B2Publication Date: 2014-10-21
- Inventor: Daisuke Yuki , Takahiro Miike , Hiroshi Mori
- Applicant: Daisuke Yuki , Takahiro Miike , Hiroshi Mori
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- Priority: JP2009-288121 20091218; JP2009-288261 20091218
- Main IPC: B32B38/18
- IPC: B32B38/18 ; H01L21/18 ; H01L21/687 ; H01L21/67 ; H01L21/683
Abstract:
A substrate holder pair comprising a first substrate holder and a second substrate holder that holds a first substrate and a second substrate bonded to each other, between itself and the first substrate holder. The first substrate holder includes a pressure receiving portion that, when the first substrate holder is separated from the second substrate holder, is pressed by a pressing member, and the second substrate holder includes a passing portion through which passes the pressing member, to enable pressing of the pressure receiving portion by the pressing member.
Public/Granted literature
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