Invention Grant
- Patent Title: Apparatus for thermal melting process and method of thermal melting process
- Patent Title (中): 热熔工艺及热熔工艺方法
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Application No.: US13392303Application Date: 2010-08-24
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Publication No.: US08864011B2Publication Date: 2014-10-21
- Inventor: Hideyuki Abe
- Applicant: Hideyuki Abe
- Applicant Address: JP
- Assignee: Ayumi Industry Co., Ltd.
- Current Assignee: Ayumi Industry Co., Ltd.
- Current Assignee Address: JP
- Agency: Fox Rothschild LLP
- Agent Richard C. Woodbridge; Ryan N. Miller
- Priority: JP2009-196687 20090827; JP2009-254255 20091105
- International Application: PCT/JP2010/064299 WO 20100824
- International Announcement: WO2011/024813 WO 20110303
- Main IPC: B23K37/00
- IPC: B23K37/00 ; B23K1/00 ; B23K3/04 ; B23K3/08 ; B23K1/008 ; H01L23/00 ; H05K3/34
Abstract:
Provide is an apparatus for thermal melting processes that is capable of directly cooling the process object without requiring a separate cooling plate.The apparatus for thermal melting process according to the present invention is an apparatus 1 for thermal melting process that thermally melts objects 100 including solder in an atmosphere containing carbonic acid vapor, and the hand part 4 for carrying and transferring the thermally melted process objects 100 is used as a cooling plate as well.
Public/Granted literature
- US20120153010A1 APPARATUS FOR THERMAL MELTING PROCESS AND METHOD OF THERMAL MELTING PROCESS Public/Granted day:2012-06-21
Information query
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