Invention Grant
- Patent Title: Fixing apparatus for waveguide plate
- Patent Title (中): 波导板固定装置
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Application No.: US13403924Application Date: 2012-02-23
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Publication No.: US08864090B2Publication Date: 2014-10-21
- Inventor: Jun-Wei Wang
- Applicant: Jun-Wei Wang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H05K9/00

Abstract:
A fixing apparatus for fixing a waveguide plate includes a number of conductive fixing members fixed to corresponding sides of the waveguide plate, and a bracket. Each fixing member includes a fixing portion having an identical length to the corresponding sidewall and a resilient abutting portion extending from a side of the fixing portion. Each fixing portion is in tight contact with the corresponding side of the waveguide plate. The waveguide plate is received in the bracket. The resilient abutting portions resiliently abut against an inner surface of the bracket.
Public/Granted literature
- US20130105654A1 FIXING APPARATUS FOR WAVEGUIDE PLATE Public/Granted day:2013-05-02
Information query
IPC分类: