Invention Grant
- Patent Title: Printer substrate edge trimming
- Patent Title (中): 打印机基板边缘修边
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Application No.: US13335317Application Date: 2011-12-22
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Publication No.: US08864394B2Publication Date: 2014-10-21
- Inventor: Marian Cofler
- Applicant: Marian Cofler
- Applicant Address: IL Netanya
- Assignee: Hewlett-Packard Industrial Printing Ltd.
- Current Assignee: Hewlett-Packard Industrial Printing Ltd.
- Current Assignee Address: IL Netanya
- Main IPC: B41J11/68
- IPC: B41J11/68

Abstract:
According to one example of the present invention there is provided a printer for a printing on a roll of substrate. The printer comprises a substrate support for receiving a roll of substrate, a drive mechanism for driving substrate from a roll of substrate when installed on the substrate support through a print writing module, and a substrate edge trimming module for trimming the longitudinal edges of a substrate prior to the substrate passing through the print writing module.
Public/Granted literature
- US20130164070A1 PRINTER SUBSTRATE EDGE TRIMMING Public/Granted day:2013-06-27
Information query
IPC分类: