Invention Grant
US08864532B2 Communications jacks having low crosstalk and/or solder-less wire connection assemblies
有权
具有低串扰和/或无焊接线连接组件的通信插孔
- Patent Title: Communications jacks having low crosstalk and/or solder-less wire connection assemblies
- Patent Title (中): 具有低串扰和/或无焊接线连接组件的通信插孔
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Application No.: US13835240Application Date: 2013-03-15
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Publication No.: US08864532B2Publication Date: 2014-10-21
- Inventor: Wayne D. Larsen , Amid I. Hashim
- Applicant: CommScope, Inc. of North Carolina
- Applicant Address: US NC Hickory
- Assignee: CommScope, Inc. of North Carolina
- Current Assignee: CommScope, Inc. of North Carolina
- Current Assignee Address: US NC Hickory
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Main IPC: H01R24/00
- IPC: H01R24/00 ; H01R13/719
Abstract:
Communications jacks include a housing having a plug aperture, a plurality of input contacts, a plurality of output contacts, and a flexible printed circuit board that includes a plurality of conductive pads and a plurality of conductive paths that each electrically connect a respective one of the input contacts to a respective one of the conductive pads. The conductive paths are arranged as a plurality of differential pairs of conductive paths, and each output contact includes a spring-biased base and an insulation displacement portion.
Public/Granted literature
- US20140273639A1 Communications Jacks Having Low Crosstalk And/or Solder-less Wire Connection Assemblies Public/Granted day:2014-09-18
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