Invention Grant
- Patent Title: Substrate treatment apparatus
- Patent Title (中): 基板处理装置
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Application No.: US12492571Application Date: 2009-06-26
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Publication No.: US08864937B2Publication Date: 2014-10-21
- Inventor: Yasuhiko Ohashi
- Applicant: Yasuhiko Ohashi
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2008-202762 20080806
- Main IPC: C23F1/02
- IPC: C23F1/02 ; H01L21/687 ; H01L21/67
Abstract:
A substrate treatment apparatus includes: a treatment chamber provided therein with a chemical solution treatment area for treating a substrate with a chemical solution and a drying treatment area provided above the chemical solution treatment area for drying the substrate; a substrate holding member vertically movably provided in the treatment chamber for holding the substrate; and a lifting mechanism vertically moving the substrate in the range between the chemical solution treatment area and the drying treatment area.
Public/Granted literature
- US20100032097A1 SUBSTRATE TREATMENT APPARATUS Public/Granted day:2010-02-11
Information query
IPC分类:
