Invention Grant
- Patent Title: Protective cover plate
- Patent Title (中): 保护盖板
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Application No.: US14055305Application Date: 2013-10-16
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Publication No.: US08865282B2Publication Date: 2014-10-21
- Inventor: Cheng-Chung Hsu
- Applicant: Tsung-Fen Wang , Cheng-Chung Hsu , Chien-Liang Liu , Chun-Sheng Lin , Shiu Yang Technology Co., Ltd , Yo Want Technology Co., Ltd
- Applicant Address: TW Taipei TW Taoyuan County TW Taoyuan County TW Taipei TW Taoyuan TW Taoyuan
- Assignee: Tsung-Fen Wang,Cheng-Chung Hsu,Chien-Liang Liu,Chun-Sheng Lin,Shiu Yang Technology Co., Ltd,Yo Want Technology Co., Ltd
- Current Assignee: Tsung-Fen Wang,Cheng-Chung Hsu,Chien-Liang Liu,Chun-Sheng Lin,Shiu Yang Technology Co., Ltd,Yo Want Technology Co., Ltd
- Current Assignee Address: TW Taipei TW Taoyuan County TW Taoyuan County TW Taipei TW Taoyuan TW Taoyuan
- Agency: Jackson IPG PLLC
- Priority: TW102205238U 20130321
- Main IPC: B32B9/00
- IPC: B32B9/00 ; B32B33/00 ; B32B7/12 ; B32B38/14 ; B32B7/04 ; B32B7/06 ; B32B3/10 ; B32B27/36 ; B32B7/14 ; B32B17/10 ; C09J7/02

Abstract:
A protective cover plate mainly comprises a substrate, a printing layer, an ultraviolet layer and an adhesive layer, wherein the printing layer is disposed at a side surface of the substrate. The printing layer is formed with at least a pattern. The pattern protrudes the substrate to form a segmental difference surface. The ultraviolet layer is disposed to another side surface of the printing layer relative to the substrate, and the ultraviolet layer is disposed with at least a filling portion. The filling portion can be relatively located near the pattern to fill the segmental difference surface of the pattern to flat the surface. A side of the ultraviolet layer is disposed with the adhesive layer. The plate can be adhered to the article by utilizing the adhesive layer. The protective cover plate does not only have flat appearance but also achieves dustproof and dirt prevention efficacies.
Public/Granted literature
- US20140287203A1 PROTECTIVE COVER PLATE Public/Granted day:2014-09-25
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