A method for bonding a light emitting diode (LED) for an LED module and a resulting LED structure are provided. The method may include preparing an LED comprising a first semiconductor layer, an active layer, and a second semiconductor layer on a substrate, applying a liquid on a mounting substrate which is oxidizable, and bonding a surface of the LED, on which a substrate is disposed, onto the mounting substrate during oxidation of the mounting substrate by the liquid. The resulting LED structure features substantially reduced thickness in a smaller overall package and one or more oxidized metallic layers exhibiting lower thermal insulation for better LED optical efficiency.