Invention Grant
- Patent Title: Semiconductor device and method for manufacturing a semiconductor device
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13859816Application Date: 2013-04-10
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Publication No.: US08865526B2Publication Date: 2014-10-21
- Inventor: Ta-Te Chou , Yong-Qi Tian , Xian Li
- Applicant: Vishay General Semiconductor LLC
- Applicant Address: US NY Hauppauge
- Assignee: Vishay General Semiconductor LLC
- Current Assignee: Vishay General Semiconductor LLC
- Current Assignee Address: US NY Hauppauge
- Agency: Mayer & Williams PC
- Agent Stuart H. Mayer; Karin L. Williams
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/40 ; H01L23/495 ; H01L23/367 ; H01L23/31
Abstract:
A semiconductor device mountable to a substrate is provided. The device includes a semiconductor package having at least one semiconductor die, an electrically conductive attachment region, and a packaging material in which is embedded the semiconductor die and a first portion of the electrically conductive attachment region contacting the die. A metallic shell encloses the embedded semiconductor die and the first portion of the electrically conductive attachment region.
Public/Granted literature
- US20130224911A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2013-08-29
Information query
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