Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13170711Application Date: 2011-06-28
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Publication No.: US08865536B2Publication Date: 2014-10-21
- Inventor: Tatsuya Sugimachi
- Applicant: Tatsuya Sugimachi
- Applicant Address: JP Yokohama
- Assignee: Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Semiconductor Limited
- Current Assignee Address: JP Yokohama
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2010-217026 20100928
- Main IPC: H01L27/06
- IPC: H01L27/06

Abstract:
As for a bypass capacitor, a first capacitor insulating film, together with a tunnel insulating film of a storage element, is formed of a first insulating film, a first electrode being a lower electrode, together with floating gate electrodes of the storage element, is formed of a doped·amorphous silicon film (a crystallized one), a second capacitor insulating film, together with a gate insulating film of transistors of 5 V in a peripheral circuit, is formed of a second insulating film, and a second electrode being an upper electrode, together with control gate electrodes of the storage element and gate electrodes of the transistors in the peripheral circuit, is formed of a polycrystalline silicon film.
Public/Granted literature
- US20120074478A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2012-03-29
Information query
IPC分类: