Invention Grant
- Patent Title: Patterned line end space
- Patent Title (中): 图案线端空间
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Application No.: US13734190Application Date: 2013-01-04
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Publication No.: US08865600B2Publication Date: 2014-10-21
- Inventor: Chia-Ying Lee , Jyu-Horng Shieh
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group, LLC
- Main IPC: H01L21/31
- IPC: H01L21/31 ; H01L21/02

Abstract:
One or more techniques or systems for forming a line end space structure are provided herein. In some embodiments, a first patterned second hard mask (HM) region is formed above a first HM region. In some embodiments, a first sacrificial HM region and a second sacrificial HM region are formed above at least one of the first patterned second HM region or the first HM region. Photo resist (PR) is patterned above the second sacrificial HM region, and a spacer region is deposited above the PR and second sacrificial HM region. In some embodiments, at least some of at least one of the spacer region, the PR, or the respective sacrificial HMs is removed. Accordingly, first patterned second hard mask (HM) region is patterned, thus forming the line end space structure associated with an end-to-end space.
Public/Granted literature
- US20140193980A1 PATTERNED LINE END SPACE Public/Granted day:2014-07-10
Information query
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