A hydrosilylation curable composition containing a comprising (A) 100 parts by weight of an organic polymer having on average at least 1.4 alkenyl groups per molecule; (B) an amount sufficient to cure the composition of a crosslinker having on average at least 1.4 Si—H groups per molecule; (C) a platinum group metal-containing catalyst in an amount sufficient to effect curing of the composition; (D) 0.1 to 20 parts by weight per 100 parts by weight of (A) of an alkoxy silyl substituted organic oligomer having a number average molecular weight in the range of 200 to 5,000, having a polymer backbone selected from the group of polybutadiene, polyisoprene, polyisobutylene, copolymers of isobutylene and isoprene, copolymers of isoprene and butadiene, copolymers of isoprene and styrene, copolymers of butadiene and styrene, copolymers of isoprene, butadiene and styrene and polyolefin polymers prepared by hydrogenating polyisoprene, polybutadiene or a copolymer of isoprene and styrene, a copolymer of butadiene and styrene or a copolymer of isoprene, butadiene and styrene, and optionally a titanium compound having Ti—O—C bonds. The composition provides improved self adhesion to substrates.