Invention Grant
- Patent Title: HEMT semiconductor component with field plates
- Patent Title (中): HEMT半导体元件与现场板
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Application No.: US12449700Application Date: 2008-02-21
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Publication No.: US08866191B2Publication Date: 2014-10-21
- Inventor: Eldat Bahat-Treidel , Victor Sidorov , Joachim Wuerfl
- Applicant: Eldat Bahat-Treidel , Victor Sidorov , Joachim Wuerfl
- Applicant Address: DE Berlin
- Assignee: Forschungsverbund Berlin E.V.
- Current Assignee: Forschungsverbund Berlin E.V.
- Current Assignee Address: DE Berlin
- Agency: Christie, Parker & Hale, LLP
- Priority: DE102007010562 20070222
- International Application: PCT/EP2008/052131 WO 20080221
- International Announcement: WO2008/101989 WO 20080828
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/40 ; H01L29/47 ; H01L29/06

Abstract:
A transistor in which the electric field is reduced in critical areas using field plates, permitting the electric field to be more uniformly distributed along the component, is provided, wherein the electric field in the active region is smoothed and field peaks are reduced. The semiconductor component has a substrate with an active layer structure, a source contact and a drain contact located on said active layer structure. The source contact and the drain contact are mutually spaced and at least one part of a gate contact is provided on the active layer structure in the region between the source contact and the drain contact, a gate field plate being electrically connected to the gate contact. In addition, at least two separate field plates are placed directly on the active layer structure or directly on a passivation layer.
Public/Granted literature
- US20110221011A1 SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME Public/Granted day:2011-09-15
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