Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US13786331Application Date: 2013-03-05
-
Publication No.: US08866220B2Publication Date: 2014-10-21
- Inventor: Hitoshi Kobayashi
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick PC
- Priority: JP2012-167696 20120727
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/36

Abstract:
According to one embodiment, a semiconductor device includes a semiconductor section, a control electrode, and a first electrode. The semiconductor section extends in a first direction. The control electrode is provided across a first insulating film from the semiconductor section in a second direction. The semiconductor section includes first, second, third, and fourth semiconductor regions. The first semiconductor region has a first conductivity type. The second semiconductor region has a second conductivity type, and is provided on the first semiconductor region to oppose the control electrode. The third semiconductor region has the first conductivity type, and is provided on the second semiconductor region. The fourth semiconductor region has the second conductivity type, and is provided together with the third semiconductor region. The first electrode is provided on the semiconductor section. The fourth semiconductor region is provided displaced to opposite side of the semiconductor section from the control electrode.
Public/Granted literature
- US20140027845A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-01-30
Information query
IPC分类: