Invention Grant
- Patent Title: Hybrid integrated component and method for the manufacture thereof
- Patent Title (中): 混合集成组件及其制造方法
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Application No.: US13869692Application Date: 2013-04-24
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Publication No.: US08866238B2Publication Date: 2014-10-21
- Inventor: Johannes Classen
- Applicant: Johannes Classen
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Kenyon & Kenyon LLP
- Priority: DE102012206854 20120425
- Main IPC: H01L29/84
- IPC: H01L29/84 ; H01L21/50 ; B81C1/00 ; B81B3/00 ; B81C3/00 ; B81B7/00

Abstract:
Hybrid integrated components including an MEMS element and an ASIC element are described, whose capacitor system allows both signal detection with comparatively high sensitivity and sensitive activation of the micromechanical structure of the MEMS element. The hybrid integrated component includes an MEMS element having a micromechanical structure which extends over the entire thickness of the MEMS substrate. At least one structural element of this micromechanical structure is deflectable and is operationally linked to at least one capacitor system, which includes at least one movable electrode and at least one stationary electrode. Furthermore, the component includes an ASIC element having at least one electrode of the capacitor system. The MEMS element is mounted on the ASIC element, so that there is a gap between the micromechanical structure and the surface of the ASIC element. According to the invention, at least one electrode of the capacitor system is separated from the layered structure of the ASIC element and instead mechanically and electrically connected to the deflectable structural element of the MEMS element, so that this electrode functions as a movable electrode of the capacitor system.
Public/Granted literature
- US20130285166A1 HYBRID INTEGRATED COMPONENT AND METHOD FOR THE MANUFACTURE THEREOF Public/Granted day:2013-10-31
Information query
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