Invention Grant
- Patent Title: Semiconductor package
- Patent Title (中): 半导体封装
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Application No.: US13735667Application Date: 2013-01-07
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Publication No.: US08866288B2Publication Date: 2014-10-21
- Inventor: Jong Man Kim , Young Hoon Kwak , Chang Seob Hong , Soon Gyu Yim
- Applicant: Samsung Electro-Mechanics Co., Ltd.
- Applicant Address: KR Gyunggi-DO
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-DO
- Agency: Ladas & Parry, LLP
- Priority: KR10-2012-0116069 20121018
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H01L23/34
Abstract:
Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer.
Public/Granted literature
- US20140110830A1 SEMICONDUCTOR PACKAGE Public/Granted day:2014-04-24
Information query
IPC分类:
