Invention Grant
US08866291B2 Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
有权
倒装芯片安装的微带单片微波集成电路（MMIC）
- Patent Title: Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
- Patent Title (中): 倒装芯片安装的微带单片微波集成电路（MMIC）
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Application No.: US13370915Application Date: 2012-02-10
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Publication No.: US08866291B2Publication Date: 2014-10-21
- Inventor: Roberto W. Alm
- Applicant: Roberto W. Alm
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L29/66 ; H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A microstrip MMIC chip flip-chip mounted to a printed circuit board with conductive vias passing through the chip to electrical connect a ground plane of the microstrip MMIC chip to a ground conductor of the printed circuit board.
Public/Granted literature
- US20130208434A1 FLIP-CHIP MOUNTED MICROSTRIP MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICs) Public/Granted day:2013-08-15
Information query
IPC分类:
