Invention Grant
- Patent Title: Semiconductor packages with integrated antenna and methods of forming thereof
- Patent Title (中): 集成天线的半导体封装及其形成方法
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Application No.: US13736641Application Date: 2013-01-08
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Publication No.: US08866292B2Publication Date: 2014-10-21
- Inventor: Gottfried Beer , Maciej Wojnowski , Mehran Pour Mousavi
- Applicant: Gottfried Beer , Maciej Wojnowski , Mehran Pour Mousavi
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater & Matsil, L.L.P.
- Priority: EP12007249 20121019
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/498 ; H01L21/768
Abstract:
In accordance with an embodiment of the present invention, a semiconductor package includes a substrate having a first major surface and an opposite second major surface. A first chip is disposed in the substrate. The first chip includes a plurality of contact pads at the first major surface. A via bar is disposed in the substrate. An antenna structure is disposed within the via bar.
Public/Granted literature
- US20140110841A1 Semiconductor Packages with Integrated Antenna and Methods of Forming Thereof Public/Granted day:2014-04-24
Information query
IPC分类:
