Invention Grant
US08866313B2 Substrate, semiconductor construction, and manufacturing method thereof 有权
基板,半导体构造及其制造方法

Substrate, semiconductor construction, and manufacturing method thereof
Abstract:
A substrate includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is set to bond a die. The glue spreading pattern is placed in the die-bonding zone and includes a containing space. The die is placed on the glue spreading pattern, an area of a bottom of the die is greater than an area of an opening of the glue spreading pattern, the containing room of the glue spreading pattern is filled with a glue, and the die is bonded to the substrate by means of the glue.
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