Invention Grant
- Patent Title: Touch-controlled electronic apparatus and related assembly method
- Patent Title (中): 触控电子仪器及相关装配方法
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Application No.: US12862796Application Date: 2010-08-25
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Publication No.: US08866755B2Publication Date: 2014-10-21
- Inventor: Hsin-Hao Lee , Chia-Jun Chia
- Applicant: Hsin-Hao Lee , Chia-Jun Chia
- Applicant Address: TW Taoyuan, Taoyuan County
- Assignee: HTC Corporation
- Current Assignee: HTC Corporation
- Current Assignee Address: TW Taoyuan, Taoyuan County
- Agent Winston Hsu; Scott Margo
- Priority: TW99114071A 20100503
- Main IPC: G06F3/041
- IPC: G06F3/041 ; G06F3/044 ; G06F1/16
Abstract:
A touch-controlled electronic apparatus includes a loading plate, a touch panel, a flexible PCB, a sensor pad, and a control circuit. The loading plate has a display touch area, a wire area, and a hot bonding area. The touch panel is disposed on the display touch area of the loading plate. The flexible PCB has a touch button area and a control circuit area. The sensor pad is disposed on the touch button area of the flexible PCB and is used as touch buttons. The control circuit is disposed on the control circuit area of the flexible PCB. The flexible PCB is disposed and bonded to the loading plate, wherein the touch button area is disposed on at least one of the wire area and the hot bonding area.
Public/Granted literature
- US20110267284A1 TOUCH-CONTROLLED ELECTRONIC APPARATUS AND RELATED ASSEMBLY METHOD Public/Granted day:2011-11-03
Information query
