Invention Grant
- Patent Title: Integrated circuit device and electronic equipment
- Patent Title (中): 集成电路设备和电子设备
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Application No.: US12845983Application Date: 2010-07-29
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Publication No.: US08866829B2Publication Date: 2014-10-21
- Inventor: Hideki Ogawa , Yoshiro Iwasa
- Applicant: Hideki Ogawa , Yoshiro Iwasa
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2009-182209 20090805
- Main IPC: G06T1/60
- IPC: G06T1/60 ; G11C5/02 ; H01L23/00 ; G09G5/39 ; G09G5/393 ; G09G5/395
Abstract:
An integrated circuit device includes: a first pad to an ith pad connected to a first memory pad to an ith memory pad of a memory stacked in the integrated circuit device; a jth pad to a kth pad connected to a jth memory pad to a kth (1
Public/Granted literature
- US20110032263A1 INTEGRATED CIRCUIT DEVICE AND ELECTRONIC EQUIPMENT Public/Granted day:2011-02-10
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