Invention Grant
- Patent Title: Multilayer ceramic electronic component and fabricating method thereof
- Patent Title (中): 多层陶瓷电子元件及其制造方法
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Application No.: US13074468Application Date: 2011-03-29
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Publication No.: US08867188B2Publication Date: 2014-10-21
- Inventor: Joon Hee Kim , Jong Hoon Bae , Byung Soo Kim
- Applicant: Joon Hee Kim , Jong Hoon Bae , Byung Soo Kim
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2010-0123421 20101206
- Main IPC: H01G4/06
- IPC: H01G4/06 ; H01G4/005 ; H01G4/30 ; H01G4/12

Abstract:
There are provided a multilayer ceramic electronic component and a fabricating method thereof. The multilayer ceramic electronic component includes: a multilayer ceramic body including a first ceramic powder and having a plurality of ceramic sheets stacked therein, each ceramic sheet having a thickness of 1 μm or less; internal electrode patterns formed on the plurality of ceramic sheets; and dielectric patterns formed on the ceramic sheets to enclose the internal electrode patterns, the dielectric patterns including a second ceramic powder having a particle size smaller than that of the first ceramic powder and each having a thickness equal to or thinner than that of each of the internal electrode patterns.
Public/Granted literature
- US20120140377A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF Public/Granted day:2012-06-07
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