Invention Grant
- Patent Title: Packaging board with visual recognition windows
- Patent Title (中): 包装板与视觉识别窗口
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Application No.: US13209062Application Date: 2011-08-12
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Publication No.: US08867220B2Publication Date: 2014-10-21
- Inventor: Yukinori Kita
- Applicant: Yukinori Kita
- Applicant Address: JP Yokkaichi
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP Yokkaichi
- Agency: Oliff PLC
- Priority: JP2010-278454 20101214
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/30 ; H05K3/34
Abstract:
A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.
Public/Granted literature
- US20120145436A1 PACKAGING BOARD Public/Granted day:2012-06-14
Information query
