Invention Grant
- Patent Title: Semiconductor integrated circuit
- Patent Title (中): 半导体集成电路
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Application No.: US11906725Application Date: 2007-10-03
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Publication No.: US08867868B2Publication Date: 2014-10-21
- Inventor: Natsuki Kushiyama , Yukihiro Urakawa
- Applicant: Natsuki Kushiyama , Yukihiro Urakawa
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Sprinkle IP Law Group
- Priority: JP2006-272087 20061003; JP2006-272088 20061003
- Main IPC: G02B6/30
- IPC: G02B6/30 ; G02B6/43 ; G02B6/12 ; G06F1/10

Abstract:
A semiconductor integrated circuit according to an example of the present invention includes a chip substrate, first and second switches arranged on the chip substrate in which ON/OFF of an electrical signal path is directly controlled by an optical signal, a first light shielding layer arranged above the chip substrate, an optical waveguide layer arranged on the first light shielding layer, a second light shielding layer arranged on the optical waveguide layer, a reflecting plate arranged in the optical waveguide layer to change an advancing direction of the optical signal, and means for leading the optical signal to the first and second switches from an inside of the optical waveguide layer. The first and second light shielding layers reflect the optical signal, and the optical waveguide layer transmits the optical signal radially.
Public/Granted literature
- US20080080809A1 Semiconductor integrated circuit Public/Granted day:2008-04-03
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