Invention Grant
- Patent Title: Optical printed circuit board and method of fabricating the same
- Patent Title (中): 光学印刷电路板及其制造方法
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Application No.: US13500779Application Date: 2010-03-24
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Publication No.: US08867871B2Publication Date: 2014-10-21
- Inventor: Jae Bong Choi
- Applicant: Jae Bong Choi
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2009-0095841 20091008; KR10-2009-0096271 20091009
- International Application: PCT/KR2010/001799 WO 20100324
- International Announcement: WO2011/043521 WO 20110414
- Main IPC: G02B6/12
- IPC: G02B6/12 ; H05K1/02 ; G02B6/43 ; H01L23/00 ; H05K1/18 ; H05K3/46

Abstract:
An optical printed circuit board (PCB) and a method of fabricating the same wherein the optical PCB is mounted with an alignment pattern area whose particular area of an integral optical connection module embedded in the optical PCB is exposed, and the alignment pattern area is formed with a sill lower than a surface of the optical PCB, whereby a transmission/reception module automatically aligned via the alignment pattern area is eased to increase the alignment accuracy between an optical connection module and the transmission/reception module and to increase the efficiency of alignment.
Public/Granted literature
- US20120263412A1 Optical Printed Circuit Board and Method of Fabricating the Same Public/Granted day:2012-10-18
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