Invention Grant
- Patent Title: Optical waveguide forming epoxy resin composition, optical waveguide forming curable film, light transmission flexible printed board, and production method for the flexible printed board
- Patent Title (中): 光波导形成环氧树脂组合物,光波导形成固化膜,透光柔性印刷电路板以及柔性印刷电路板的制造方法
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Application No.: US13795237Application Date: 2013-03-12
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Publication No.: US08867885B2Publication Date: 2014-10-21
- Inventor: Tomoyuki Hirayama
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-100146 20120425
- Main IPC: G02B6/00
- IPC: G02B6/00 ; C08L63/00 ; G03F7/004 ; C08G59/68 ; G03F7/038 ; C08G59/24 ; G02B6/02

Abstract:
An optical waveguide forming epoxy resin composition is free from a diluent component irrelevant to a curing reaction, and comprises: (A) a liquid epoxy resin; and (B) a photoacid generator; wherein the liquid epoxy resin (A) comprises a liquid epoxy resin represented by the following general formula (1) in a proportion of 40 to 75 wt % based on the overall amount of a resin component: wherein R1 and R2 are each a hydrogen atom or a methyl group; R3 to R6 are each a hydrogen atom, a methyl group, a chlorine atom or a bromine atom; X is a C2 to C15 alkylene group, an ethyleneoxy group, a di(ethyleneoxy) group, a tri(ethyleneoxy) group, a propyleneoxy group, a propyleneoxypropyl group, a di(propyleneoxy)propyl group or a tri(propyleneoxy)propyl group; and n is a natural number and has an average value of 1.2 to 5.
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