Invention Grant
US08868233B2 Control apparatus, a substrate treating method, a substrate treating system, a method of operating a substrate treating system, a load port control apparatus, and a substrate treating system having the load port control apparatus
有权
控制装置，基板处理方法，基板处理系统，操作基板处理系统的方法，负载端口控制装置和具有负载端口控制装置的基板处理系统
- Patent Title: Control apparatus, a substrate treating method, a substrate treating system, a method of operating a substrate treating system, a load port control apparatus, and a substrate treating system having the load port control apparatus
- Patent Title (中): 控制装置，基板处理方法，基板处理系统，操作基板处理系统的方法，负载端口控制装置和具有负载端口控制装置的基板处理系统
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Application No.: US13541345Application Date: 2012-07-03
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Publication No.: US08868233B2Publication Date: 2014-10-21
- Inventor: Hideki Shibata
- Applicant: Hideki Shibata
- Applicant Address: JP
- Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee: Dainippon Screen Mfg. Co., Ltd.
- Current Assignee Address: JP
- Agency: Ostrolenk Faber LLP
- Priority: JP2011-148772 20110705
- Main IPC: G06F7/00
- IPC: G06F7/00 ; H01L21/67 ; H01L21/677 ; G05B19/418
Abstract:
A control apparatus in a substrate treating system with a substrate treating apparatus having a physical load port for receiving pods for storing substrates, and a carrier transport system for transporting the pods to and from the physical load port. The control apparatus includes a virtual load port control device for allotting a virtual load port to the physical load port, and instructing the carrier transport system to perform a transporting operation to and from the virtual load port on an assumption that the virtual load port really exists.
Public/Granted literature
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