Invention Grant
- Patent Title: Apparatus for monitoring a door with a 3D sensor
- Patent Title (中): 用于利用3D传感器监控门的装置
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Application No.: US13295624Application Date: 2011-11-14
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Publication No.: US08868376B2Publication Date: 2014-10-21
- Inventor: Beat De Coi
- Applicant: Beat De Coi
- Applicant Address: CH Landquart
- Assignee: Cedes AG
- Current Assignee: Cedes AG
- Current Assignee Address: CH Landquart
- Agency: Burr & Brown, PLLC
- Priority: EP10014616 20101115
- Main IPC: F16P3/14
- IPC: F16P3/14 ; G01B21/16 ; G01C3/00 ; G01S7/497 ; E05F15/00 ; F16M11/06 ; F16M13/02 ; G01S7/481 ; G01S17/02 ; G01S17/88 ; E05F15/20

Abstract:
An apparatus for monitoring a door with a 3D sensor which is able to detect distances to an object in the monitoring area as the third dimension, the 3D sensor being arranged in a housing, and immovably arranged transmission means for transmitting a measurement beam and receiver means for receiving a reflected measurement beam being provided in the housing, characterized in that provision is made of a control unit which is designed to obtain an item of information relating to the position of the apparatus, and in that the control unit evaluates the measurement beam on the basis of an item of position information.
Public/Granted literature
- US20120150487A1 APPARATUS FOR MONITORING A DOOR WITH A 3D SENSOR Public/Granted day:2012-06-14
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