Invention Grant
US08868892B2 Method and apparatus for selective heating for electronic components of a handheld device 有权
用于选择性加热手持设备的电子部件的方法和装置

  • Patent Title: Method and apparatus for selective heating for electronic components of a handheld device
  • Patent Title (中): 用于选择性加热手持设备的电子部件的方法和装置
  • Application No.: US12974547
    Application Date: 2010-12-21
  • Publication No.: US08868892B2
    Publication Date: 2014-10-21
  • Inventor: David Neil Ardron
  • Applicant: David Neil Ardron
  • Applicant Address: CA Mississauga, Ontario
  • Assignee: Psion Inc.
  • Current Assignee: Psion Inc.
  • Current Assignee Address: CA Mississauga, Ontario
  • Main IPC: G06F9/46
  • IPC: G06F9/46 G06F1/20
Method and apparatus for selective heating for electronic components of a handheld device
Abstract:
A method and apparatus for thermal management of components and functional subsystems of a handheld device, including for a peripheral device electrically coupled to thereto. A power source provides power to a plurality of functional subsystems of the handheld device and optionally the peripheral device. The components and functional subsystems comprise predetermined thermal signatures.
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