Invention Grant
- Patent Title: Oversized interposer formed from a multi-pattern region mask
- Patent Title (中): 由多图案区域掩模形成的超大插入器
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Application No.: US13535102Application Date: 2012-06-27
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Publication No.: US08869088B1Publication Date: 2014-10-21
- Inventor: Rafael C. Camarota
- Applicant: Rafael C. Camarota
- Applicant Address: US CA San Jose
- Assignee: Xilinx, Inc.
- Current Assignee: Xilinx, Inc.
- Current Assignee Address: US CA San Jose
- Agent W. Eric Webostad
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An embodiment of an interposer is disclosed. In such an embodiment, there is a first printed circuit region and a second printed circuit region. The second printed circuit region is proximate to the first printed circuit region with a seam region between the first printed circuit region and the second printed circuit region. The seam region includes a first die seal and a second die seal spaced apart from one another with a scribe line located between the first die seal and the second die seal.
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