Invention Grant
US08871827B2 Hotmelt adhesive comprising radiation-crosslinkable poly(meth)acrylate and oligo(meth)acrylate with nonacrylic C-C double bonds
有权
包含可辐射交联的聚（甲基）丙烯酸酯和具有非丙烯酸C-C双键的低聚（甲基）丙烯酸酯）的热熔粘合剂
- Patent Title: Hotmelt adhesive comprising radiation-crosslinkable poly(meth)acrylate and oligo(meth)acrylate with nonacrylic C-C double bonds
- Patent Title (中): 包含可辐射交联的聚（甲基）丙烯酸酯和具有非丙烯酸C-C双键的低聚（甲基）丙烯酸酯）的热熔粘合剂
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Application No.: US13487550Application Date: 2012-06-04
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Publication No.: US08871827B2Publication Date: 2014-10-28
- Inventor: Ulrike Licht , Dirk Wulff , Thomas Christ , Ulrich Filges
- Applicant: Ulrike Licht , Dirk Wulff , Thomas Christ , Ulrich Filges
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: C08F20/22
- IPC: C08F20/22 ; B29D11/00 ; C08F2/46 ; C08G61/04 ; C09J133/10
Abstract:
Described is a radiation-crosslinkable hotmelt adhesive comprising at least one radiation-crosslinkable poly(meth)acrylate formed to an extent of at least 60% by weight of C1 to C10 alkyl(meth)acrylates and at least one oligo(meth)acrylate which comprises nonacrylic C C double bonds and has a K value of less than or equal to 20. The hotmelt adhesive comprises a photoinitiator which may be present in the form of an additive not attached to the poly(meth)acrylate and/or not attached to the oligo(meth)acrylate, may be incorporated by copolymerization into the poly(meth)acrylate, and/or may be attached to the oligo(meth)acrylate. The hotmelt adhesive can be used for producing adhesive tapes.
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