Invention Grant
- Patent Title: Nonvolatile semiconductor memory device and method for manufacturing the same
- Patent Title (中): 非易失性半导体存储器件及其制造方法
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Application No.: US13399195Application Date: 2012-02-17
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Publication No.: US08873266B2Publication Date: 2014-10-28
- Inventor: Tatsuya Okamoto
- Applicant: Tatsuya Okamoto
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2011-033004 20110218
- Main IPC: G11C7/02
- IPC: G11C7/02 ; H01L29/788 ; H01L21/765 ; H01L27/115 ; H01L29/423

Abstract:
According to one embodiment, a nonvolatile semiconductor memory device includes a first memory string including a first memory cell and a second memory cell aligned along a first axis, a source contact provided at a source-side end of the first memory string, a second memory string that extends along the first axis and includes a third memory cell that aligns with the first memory cell along a second axis perpendicular to the first axis, and a shield conductive layer. The shield conductive layer extends along the first axis between the first memory string and the second memory string and is electrically connected to the source contact.
Public/Granted literature
- US20120236652A1 NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2012-09-20
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