Invention Grant
- Patent Title: Thermoacoustic device
- Patent Title (中): 热声装置
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Application No.: US13923327Application Date: 2013-06-20
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Publication No.: US08873775B2Publication Date: 2014-10-28
- Inventor: Yang Wei , Shou-Shan Fan
- Applicant: Tsinghua University , Hon Hai Precision Industry Co., Ltd.
- Applicant Address: CN Beijing TW New Taipei
- Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Tsinghua University,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Beijing TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2012105876889 20121229
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A thermoacoustic device comprise a substrate, a number of thermoacoustic units on the substrate, a number of switches, a driving integrated circuit, a scanning integrated circuit, and a common electrode. The switches are electrically connected to the thermoacoustic units. Each of the switches is electrically connected in series between the first electrode and the driving integrated circuit through a driving electrode. Each of the switches is electrically connected to the scanning integrated circuit through a scanning electrode. The common electrode is electrically connected to the second electrode of the number of thermoacoustic units.
Public/Granted literature
- US20140185840A1 THERMOACOUSTIC DEVICE Public/Granted day:2014-07-03
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