The present invention is a flexible circuit electrode array for improved layer adhesions where the metal conductors overlap the polymer insulator. The steps to build the flexible circuit are as follows. Deposit a base polymer layer. Deposit a conductive trace over the base polymer layer. Deposit a top polymer layer over the trace and prepare a void in the top polymer layer smaller than the surface of the trace. Deposit an electrode on the trace through the void with a periphery larger than, and overlapping the void.