Invention Grant
- Patent Title: Thin film capacitors on metal foils and methods of manufacturing same
- Patent Title (中): 金属箔上的薄膜电容器及其制造方法
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Application No.: US12237409Application Date: 2008-09-25
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Publication No.: US08875363B2Publication Date: 2014-11-04
- Inventor: Seigi Suh , Esther Kim , William J. Borland , Christopher Allen Gross , Omega N. Mack , Timothy R. Overcash
- Applicant: Seigi Suh , Esther Kim , William J. Borland , Christopher Allen Gross , Omega N. Mack , Timothy R. Overcash
- Applicant Address: US DE Wilmington
- Assignee: CDA Processing Limited Liability Company
- Current Assignee: CDA Processing Limited Liability Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01G7/00
- IPC: H01G7/00 ; H05K1/16 ; H01G13/00 ; H01G4/12

Abstract:
Disclosed are methods of making a dielectric on a metal foil, and a method of making a large area capacitor that includes a dielectric on a metal foil. A first dielectric layer is formed over the metal foil by physical vapor deposition, and a dielectric precursor layer is formed over the first dielectric layer by chemical solution deposition. The metal foil, first dielectric layer and dielectric precursor layer are prefired at a prefiring temperature in the range of 350 to 650° C. The prefired dielectric precursor layer, the first dielectric layer and the base metal foil are subsequently fired at a firing temperature in the range of 700 to 1200° C.
Public/Granted literature
- US20100073845A1 THIN FILM CAPACITORS ON METAL FOILS AND METHODS OF MANUFACTURING SAME Public/Granted day:2010-03-25
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