Invention Grant
- Patent Title: Panel loading method and panel-loading support device
- Patent Title (中): 面板加载方式和面板加载支持装置
-
Application No.: US13010374Application Date: 2011-01-20
-
Publication No.: US08875370B2Publication Date: 2014-11-04
- Inventor: Hideo Kunita , Tetsuji Nakashima
- Applicant: Hideo Kunita , Tetsuji Nakashima
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2010-015048 20100127
- Main IPC: B21D39/02
- IPC: B21D39/02 ; B21D43/00

Abstract:
A panel loading method for loading an inner panel to an outer panel that has a bent portion provided by bending a periphery thereof, the outer panel and the inner panel being overlapped to integrate the outer panel and the inner panel at the periphery thereof. The method includes: providing at least one of the outer panel and the inner panel by an elastic body; disposing the outer panel onto a panel receiver so that the bent portion is directed upward; placing a guide plate on or above the bent portion; loading the inner panel into the outer panel from above the guide plate; and inserting the inner panel into an inside of the bent portion.
Public/Granted literature
- US20110179629A1 PANEL LOADING METHOD AND PANEL-LOADING SUPPORT DEVICE Public/Granted day:2011-07-28
Information query