Invention Grant
- Patent Title: Wire stripping apparatus
- Patent Title (中): 剥线装置
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Application No.: US13007352Application Date: 2011-01-14
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Publication No.: US08875599B2Publication Date: 2014-11-04
- Inventor: Tokichi Shimizu
- Applicant: Tokichi Shimizu
- Applicant Address: JP Chuo-Ku, Tokyo
- Assignee: Tokyo Ideal Co., Ltd
- Current Assignee: Tokyo Ideal Co., Ltd
- Current Assignee Address: JP Chuo-Ku, Tokyo
- Agency: Christenen O'Connor Johnson Kindness PLLC
- Priority: JP2010-008616 20100118
- Main IPC: H02G1/12
- IPC: H02G1/12

Abstract:
A wire stripping apparatus is disclosed. The apparatus comprises a clamping device for holding a first portion, a cutter having a plurality of first edges, the first edges being movable toward and away from one another in a first direction wherein the first edges provide a cut in the insulation of the wire at the second portion, and a remover having a plurality of second edges, the second edges being movable toward and away from one another in a second direction different from the first direction wherein the second edges move toward one another to grasp a third portion adjacent to the second portion of the wire away from the first portion of the wire. The remover is movable in the lengthwise direction of the wire wherein the remover moves in the lengthwise direction of the wire away from the first portion to remove the insulation from the wire.
Public/Granted literature
- US20110174115A1 WIRE STRIPPING APPARATUS Public/Granted day:2011-07-21
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