Invention Grant
- Patent Title: Spiral cutting device
- Patent Title (中): 螺旋切割装置
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Application No.: US13592360Application Date: 2012-08-23
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Publication No.: US08875605B2Publication Date: 2014-11-04
- Inventor: Hsi-Chang Wu , Yung-Chang Tseng
- Applicant: Hsi-Chang Wu , Yung-Chang Tseng
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW101120249A 20120606
- Main IPC: B23B29/00
- IPC: B23B29/00 ; B23B5/48

Abstract:
A spiral cutting device includes a blade, a blade driving shaft, a guiding device, a driving device, and a controller. The blade is for processing a roller. The blade driving shaft drives the blade to move toward the roller. The guiding device moves in a guiding direction perpendicular to a moving direction of the blade. The driving device is movably supported on the guiding device and rotates the roller. The controller controls a feeding amount of the blade, a moving speed of the driving device, and a rotate speed of the roller to spirally cut the roller. When an outer surface of the roller is unfolded to a plane, the blade path of the blade is in sinusoidal shape or in cosinusoidal shape.
Public/Granted literature
- US20130327192A1 SPIRAL CUTTING DEVICE Public/Granted day:2013-12-12
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