Invention Grant
- Patent Title: Balancing RF bridge assembly
- Patent Title (中): 平衡射频桥组件
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Application No.: US13014113Application Date: 2011-01-26
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Publication No.: US08875657B2Publication Date: 2014-11-04
- Inventor: Jonghoon Baek , Sam H. Kim , Beom Soo Park
- Applicant: Jonghoon Baek , Sam H. Kim , Beom Soo Park
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23F1/00 ; H01L21/306 ; C23C16/505

Abstract:
Embodiments disclosed herein generally relate to a PECVD apparatus. When the RF power source is coupled to the electrode at multiple locations, the current and voltage may be different at the multiple locations. In order to ensure that both the current and voltage are substantially identical at the multiple locations, an RF bridge assembly may be coupled between the multiple locations at a location just before connection to the electrode. The RF bridge assembly substantially equalizes the voltage distribution and current distribution between multiple locations. Therefore, a substantially identical current and voltage is applied to the electrode at the multiple locations.
Public/Granted literature
- US20110185972A1 BALANCING RF BRIDGE ASSEMBLY Public/Granted day:2011-08-04
Information query
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