Invention Grant
- Patent Title: Heat dissipation element with mounting structure
- Patent Title (中): 具有安装结构的散热元件
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Application No.: US13226468Application Date: 2011-09-06
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Publication No.: US08875779B2Publication Date: 2014-11-04
- Inventor: Cheng-Nan Lien
- Applicant: Cheng-Nan Lien
- Applicant Address: TW New Taipei
- Assignee: Asia Vital Compenents Co., Ltd.
- Current Assignee: Asia Vital Compenents Co., Ltd.
- Current Assignee Address: TW New Taipei
- Priority: TW100129393 20110817
- Main IPC: F28D15/00
- IPC: F28D15/00 ; H01L23/427 ; F28D15/04 ; H01L23/40 ; F28F9/00

Abstract:
A heat dissipation element with mounting structure includes a main body and a plurality of mounting elements. The main body includes a first side and a second side, between which a chamber is defined; a plurality of supports located in the chamber and respectively connected at two opposite ends to the first side and the second side of the main body; a working fluid filled in the chamber; and at least one wick structure layer internally attached to the chamber. The mounting elements respectively define an axial bore and have an end extended through the first side of the main body into the supports to thereby connect to the main body. With these arrangements, the heat dissipation element with the mounting elements connected thereto can tightly contact with a heat-generating element and maintain the chamber in the main body in an airtight state without leakage.
Public/Granted literature
- US20130043005A1 HEAT DISSIPATION ELEMENT WITH MOUNTING STRUCTURE Public/Granted day:2013-02-21
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