Invention Grant
- Patent Title: Credential manufacturing device substrate shuttle
- Patent Title (中): 凭证制造装置衬底穿梭
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Application No.: US13293595Application Date: 2011-11-10
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Publication No.: US08876110B2Publication Date: 2014-11-04
- Inventor: Ted M. Hoffman , Philip G. Umberger
- Applicant: Ted M. Hoffman , Philip G. Umberger
- Applicant Address: SE Stockholm
- Assignee: Assa Abloy AB
- Current Assignee: Assa Abloy AB
- Current Assignee Address: SE Stockholm
- Agency: Westman, Champlin & Koehler P.A.
- Main IPC: G06K5/00
- IPC: G06K5/00 ; B65H5/04 ; G06K17/00 ; G06K13/07 ; B65H15/00 ; B65H3/44

Abstract:
One embodiment of a credential manufacturing device comprises a first hopper, a first processing path, a first processing device, a substrate shuttle and a shuttle drive. The first hopper is configured to contain a plurality of card substrates and includes an output port. The first processing device is in the first processing path and is configured to perform a first process on individual card substrates in the first processing path. The substrate shuttle is positioned between the first hopper and the first processing path and is configured to receive individual card substrates from the output port of the first hopper, transport received card substrates along a shuttle path, and deliver received card substrates to the first processing path. The shuttle drive is configured to drive movement of the substrate shuttle along the shuttle path.
Public/Granted literature
- US20130121793A1 CREDENTIAL MANUFACTURING DEVICE SUBSTRATE SHUTTLE Public/Granted day:2013-05-16
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