Invention Grant
- Patent Title: Liquid ejecting head module and liquid ejecting apparatus
- Patent Title (中): 液体喷射头模块和液体喷射装置
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Application No.: US13746565Application Date: 2013-01-22
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Publication No.: US08876247B2Publication Date: 2014-11-04
- Inventor: Hiroyuki Kobayashi
- Applicant: Seiko Epson Corporatio
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-012492 20120124
- Main IPC: B41J29/393
- IPC: B41J29/393 ; B41J29/38 ; B41J2/14 ; B41J2/155
Abstract:
A liquid ejecting head module including: a head unit which has a plurality of heads having a nozzle plate on which a nozzle opening is provided; a carriage to which the liquid ejecting head unit is fixed; and a thermistor attached to the carriage, wherein the thermistor is biased to the cover head side which is in contact with the nozzle plate of a head, comes into contact with the nozzle plate and measures the temperature of the nozzle plate.
Public/Granted literature
- US20130187976A1 LIQUID EJECTING HEAD MODULE AND LIQUID EJECTING APPARATUS Public/Granted day:2013-07-25
Information query
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