Invention Grant
- Patent Title: Orifice structure for fluid ejection device and method of forming same
- Patent Title (中): 流体喷射装置的孔结构及其形成方法
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Application No.: US13563383Application Date: 2012-07-31
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Publication No.: US08876255B2Publication Date: 2014-11-04
- Inventor: Alex Veis , Tsuyoshi Yamashita
- Applicant: Alex Veis , Tsuyoshi Yamashita
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/135
- IPC: B41J2/135 ; B41J2/16 ; B41J2/14

Abstract:
An orifice structure for a fluid ejection device includes a surface, an orifice formed through the surface, a first region of the surface projecting from the orifice, and a second region of the surface surrounding the first region, with the first region having a first surface energy, and the second region having a second surface energy higher than the first surface energy.
Public/Granted literature
- US20140035998A1 ORIFICE STRUCTURE FOR FLUID EJECTION DEVICE AND METHOD OF FORMING SAME Public/Granted day:2014-02-06
Information query
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