Invention Grant
- Patent Title: Liquid ejecting head and liquid ejecting apparatus
- Patent Title (中): 液体喷头和液体喷射装置
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Application No.: US13252261Application Date: 2011-10-04
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Publication No.: US08876258B2Publication Date: 2014-11-04
- Inventor: Akira Takada
- Applicant: Akira Takada
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2010-229075 20101008
- Main IPC: B41J2/015
- IPC: B41J2/015 ; B41J2/14

Abstract:
A liquid ejecting head includes: a pressure generation chamber that communicates with a nozzle opening which ejects liquid; a pressure generation unit that causes a change in pressure in the pressure generation chamber; and a flexible wiring substrate that transmits a control signal from outside and includes a wiring layer which is connected to each individual electrode of a plurality of pressure generation units and also connected to a terminal portion of a common electrode common to the plurality of pressure generation units. In the liquid ejecting head, the wiring layer of the wiring substrate includes slits in an area connected to the terminal portion of the common electrode of the pressure generation unit, while the wiring layer of the wiring substrate and the terminal portion of the pressure generation unit are connected via an anisotropic conductive material.
Public/Granted literature
- US20120086759A1 LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS Public/Granted day:2012-04-12
Information query
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