Invention Grant
US08876510B2 Molded body production device, molded body production method, and molded body
有权
成型体生产装置,成型体生产方法和成型体
- Patent Title: Molded body production device, molded body production method, and molded body
- Patent Title (中): 成型体生产装置,成型体生产方法和成型体
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Application No.: US13393007Application Date: 2010-07-09
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Publication No.: US08876510B2Publication Date: 2014-11-04
- Inventor: Daisuke Hirokane , Akiharu Satoh , Masami Yamazaki
- Applicant: Daisuke Hirokane , Akiharu Satoh , Masami Yamazaki
- Applicant Address: JP Tokyo
- Assignee: Sumitomo Bakelite Company Ltd.
- Current Assignee: Sumitomo Bakelite Company Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2009-200479 20090831
- International Application: PCT/JP2010/061661 WO 20100709
- International Announcement: WO2011/024566 WO 20110303
- Main IPC: B29C33/58
- IPC: B29C33/58 ; B29C33/64 ; B29C43/36 ; B29C33/72

Abstract:
In a molded body production device, a release agent injection means applies a release agent onto an upper punch surface by injecting the release agent toward the upper punch surface in a state that an upper punch is located above an upper end surface of a molding die, and applies the release agent onto a lower punch surface and an inner circumferential surface exposing above the lower punch surface by injecting the release agent toward the lower punch surface in a state that the lower punch surface is located into the cavity and below the upper end surface of the molding die, before the molding material is filled into the cavity. This makes it possible to prevent the molding material from bonding to the upper punch surface, the lower punch surface and the inner circumferential surface defining the cavity.
Public/Granted literature
- US20120165502A1 MOLDED BODY PRODUCTION DEVICE, MOLDED BODY PRODUCTION METHOD, AND MOLDED BODY Public/Granted day:2012-06-28
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