Invention Grant
- Patent Title: Injection molding apparatus
- Patent Title (中): 注塑设备
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Application No.: US14348193Application Date: 2012-07-30
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Publication No.: US08876523B2Publication Date: 2014-11-04
- Inventor: Jong Hwan Kim , Hyo Sung Lim , Myung Hoon Kim
- Applicant: Jong Hwan Kim , Hyo Sung Lim , Myung Hoon Kim
- Applicant Address: KR
- Assignee: SK Innovation Co., Ltd.
- Current Assignee: SK Innovation Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2011-0112098 20111031
- International Application: PCT/KR2012/006056 WO 20120730
- International Announcement: WO2013/065931 WO 20130510
- Main IPC: B29C45/40
- IPC: B29C45/40 ; B29C45/26 ; B29C45/17
Abstract:
Provided is an injection molding apparatus including: an upper mold; a lower mold; a receive block; a fixed block; a movable block; a variable cavity; a movable block adjusting unit; and an ejector pipe.
Public/Granted literature
- US20140242211A1 INJECTION MOLDING APPARATUS Public/Granted day:2014-08-28
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