A method of manufacture of an integrated circuit socket system includes: forming a retainer plate having a pinhole extending through the retainer plate; forming a base plate having a connector hole extending through the base plate, the connector hole aligned with the pinhole; inserting a compressible pin having a lower probe end through the connector hole and the pinhole below the connector hole, a portion of the compressible pin in the base plate; forming a device plate having a cavity hole extending through the device plate and aligned with the an upper probe end of the compressible pin exposed in the cavity hole; and mounting a removable fastener through the device plate, the base plate, and into the retainer plate, the device plate over the base plate directly on the retainer plate and attached to one another by the removable fastener.