Invention Grant
- Patent Title: Crimp terminal
- Patent Title (中): 压接端子
-
Application No.: US13814122Application Date: 2011-07-15
-
Publication No.: US08876563B2Publication Date: 2014-11-04
- Inventor: Masanori Onuma , Kousuke Takemura
- Applicant: Masanori Onuma , Kousuke Takemura
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-176143 20100805
- International Application: PCT/JP2011/066211 WO 20110715
- International Announcement: WO2012/017807 WO 20120209
- Main IPC: H01R4/10
- IPC: H01R4/10 ; H01R4/28 ; H01R4/18
Abstract:
A conductor crimp portion (11) before being crimped to a conductor (Wa) of an electric wire includes, in an inner surface (11R) of the conductor crimp portion (11), circular recesses (20) as serrations of the conductor crimp portion (11) scattered to be spaced from each other. The recesses (20) each has an inner bottom surface (20A) in a form of a hemispherical surface.
Public/Granted literature
- US20130130568A1 CRIMP TERMINAL Public/Granted day:2013-05-23
Information query
